WAFER STARTS FOR MORE THAN MOORE APPLICATIONS - MARKET EVOLUTION

More than Moore devices: the wind of change

Extracted from: Wafer Starts for More Than Moore Applications report, Yole Développement – Release date: March 2018

OUTLINES:

  • Wafer Starts for More than Moore Applications - Free webcast on June 28 at 5:00 PM CEST - 8:00 AM PDT: Register today!
  • More than Moore devices' overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
  • Megatrend market are at the heart of More than Moore's wafer volume evolution.
  • 6 inch and 8 inch are forecast to represent m ore than 60% of More than Moore wafers' total wafer consumption.
  • Despite silicon's dominance in the semiconductor area, alternative substrates are disrupting the More than Moore market.

LYON, France – June 26, 2018: Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Semiconductor companies are today looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.

More-than-Moore devices (including MEMS & sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.

Between 2017 and 2023, the wafer demand for More than Moore devices is showing an impressive 10% growth (Wafer demand – 8-inch eq.). This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications, performed by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure & mobile segments, mobile including additional functionalities, voice processing, smart automotive & electrification, AR/VR , and AI .

For the first time, the market research and strategy consulting company presents a dedicated technology & market analysis focused on the overall wafer demand for More than Moore devices. The aim of this report is to give an overview of wafer shipments for More than Moore devices, from wafer size to semiconductor material substrate type including silicon, glass, SOI , SiC , SiGe , GaN , InP , GaAs , sapphire and ceramic, and thus identify business opportunities in the More than Moore industry.
For over 20 years, Yole has been analyzing the industry evolution, discussing with leading companies to understand market challenges, and identifying technical breakthroughs. The Wafer Starts for More Than Moore Applications report is the result of this 20-year research. Yole’s analysts combine technical and market expertise to describe the More than Moore world. Market size (volume & value), substrate sizes and formats, value chain, technology processes and market drivers, business opportunities and competitive landscape are all part of Yole’s analysis.

This week, Yole invites you to an overview of the Wafer Starts for More Than Moore Applications report during the exclusive online event, titled “Wafer Starts for More than Moore Applications – Webcast”. This webcast takes place on June 28 at 5:00 PM CEST.
Amandine Pizzagalli, Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing from Yole, will present key results of this report including megatrends, wafer market evolution, technical trends... Moderated by David Jourdan, Sales Coordination & Customer Service at Yole, it welcomes the two leading companies, SPTS (an Orbotech Company) and Corning Precision Glass Solutions:
   -  "Trends in Wafer Processing Technologies for RF MEMS" – Speaker David Butler, Executive Vice President and General Manager at SPTS Technologies
   -  "Benefits of Through Glass Vias for RF applications" – Speaker: Ravij Parmar, New Product Development Manager for Corning Precision Glass Solutions.

Register today!

Acronyms:
MEMS : Micro Electro Mechanical Systems
CMOS : Complementary Metal-Oxide Semiconductor
RF : Radio Frequency
AR/VR : Augmented Reality/ Virtual Reality
AI : Artificial Intelligence
SOI : Silicon On Insulator
SiC : Silicon Carbide
SiGe: Silicon Germanium
GaN: Gallium Nitride
InP: Indium Phosphide
GaAs : Gallium Arsenide


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