Power Module Packaging: Material Market and Technology Trends 2017
How new applications drive the choice of power module materials and designs

In 2016, the power module market was worth almost $3.2B and from there it will grow steadily for the next five years. As of 2016, almost 40% of the power module cost concerns raw materials used for packaging. Materials for die-attach, substrate-attach, substrate, baseplate, encapsulation, interconnections and casings constitute a $1.1B market in 2016. This market will grow and reach $1.8B by 2021. Yet the growth will not be even across all raw material markets. Die-attach materials have the highest forecast compound annual growth rate (CAGR) for 2016-2021, at over 13%. Casings and encapsulation have the lowest CAGR, at 5-7% for 2016-2021. The main differences arise from technology choices for those materials and their impact on the each market segment. For instance, the greater presence of epoxy resin will reduce the cost of encapsulation in power modules.


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