PRESSURE SENSOR - TECHNOLOGY OVERVIEW

MEMS pressure sensor technologies : multiple ways to success

Extracted from: MEMS Pressure Sensor Comparison report, System Plus Consulting - MEMS Pressure Sensor Market and Technologies report, Yole Développement, May 2018

OUTLINES:

  • MEMS pressure sensors comparison: System Plus Consulting provides insights into the structures, technical choices, designs, processes, supply chain positions and costs of 34 MEMS pressure sensor products from the leading suppliers.
  • Automotive and consumer applications are propelling the MEMS pressure sensor business to new heights.
  • MEMS pressure sensors: automotive and consumer are still the main drivers.
  • The competitive landscape varies between the automotive, consumer, medical, industrial, avionics and high-end markets.
  • Technical trends: automotive electrification will transform the pressure sensor business.

LYON, France – June 11, 2018: The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation.
Consumer is the second pressure sensor business with new consumer applications including wearables, electronic cigarette, drones… which are giving attractive perspectives to the devices’ manufacturers.
MEMS pressure sensor technologies are basically segmented into piezoresistive and capacitive categories. Both two technologies are not hugely different in terms of performance but capacitive is limited to absolute pressure applications. Today piezoresistive is leading the industry in terms of market share, and that will probably continue in the future despite growing adoption of capacitive technology in consumer application.

To complement Yole Développement (Yole) technology & market report, MEMS Pressure Sensor Market and Technologies 2018, System Plus Consulting, part of Yole Group of Companies, has conducted a unique comparative review of pressure sensors chips, modules and TPMS.
Under this new MEMS Pressure Sensor Comparison 2018 report, the reverse engineering & costing company provides insights into the structures, technical choices, designs, processes, supply chain positions and costs of a selection of key MEMS pressure sensors. 7 consumer, 14 industrial and 13 automotive MEMS pressure sensor products from the leading suppliers are so deeply analyzed in System Plus Consulting’s study. Suppliers include All Sensors, Amphenol, APM, Bosch, Denso, First Sensor, Fuji Electric, Freescale/NXP, Honeywell, Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano Keiki, Sensata, Sensirion, SMI and STMicroelectronics.
The MEMS pressure sensors comparison from System Plus Consulting points out the diversity of devices and related technologies, which are a characteristic of this industry. All manufacturing process flows and cost reviews are detailed in this report to highlight the technical choices made by each player, according to the market segments.

“In this new analysis, we identified lot of different manufacturing processes”, comments Audrey Lahrach, Cost Engineer at System Plus Consulting. “Indeed MEMS pressure devices’ packaging and pressure range differ widely according to application.”
System Plus Consulting’s report includes multiple comparisons based on physical analyses of 34 MEMS pressure sensor components. It offers buyers and device manufacturers the unique possibility of understanding MEMS pressure sensor technology evolution, and comparing product costs.

“... MEMS pressure devices’ packaging and pressure range differ widely according to application...”
(Audrey Lahrach, Cost Engineer at System Plus Consulting)

“The System Plus Consulting’s report is very powerful tool to have a precise idea of the device cost and therefore the company margins. It enables also to understand technologies used for the MEMS sensor, but also for the ASIC, the packaging and even the integration into the module. This report is the perfect combination with our market report” comments Yann de Charentenay, Senior Market Analyst from Yole.

Analysts compare the devices that use piezoresistive or capacitive technology, manufactured with bulk micromachining or surface micromachining processes, first level packaging or module packaging, monolithic or multi-chip structures. The team looks at their package dimensions and internal structures, MEMS and ASIC dies, die dimensions and package cross-sections, to provide a comprehensive review of MEMS pressure sensors. A detailed description of System Plus Consulting report is available: Here.

System Plus Consulting and Yole’s team will attend a selection of valuable MEMS & Sensors conferences during the next few months. Save the following dates in your agenda right now!
  •  Sensors Expo & Conference (June 26-28, San Jose, USA) with two presentations: “The perceptual era of IoT has begun, mobile phones first” on June 27 at 10:00 AM – Speaker: Guillaume Girardin, Photonics, Sensing and Display Head of Division at Yole Développement. “Autonomous Vehicle Sensors and Sensor Fusion” on June 26 within the Automotive Workshop – Speaker: Dr. Yohann Tschudi, Software & Market Analyst & Guillaume Girardin, Photonics, Sensing and Display Head of Division at Yole Développement
trade shows all year long. Next dates are:
  •  MEMS Manufacturing (August 1-2, 2018) powered by MEMS Journal’s team: System Plus Consulting’s CTO, Romain Fraux proposes a presentation titled “MEMS Manufacturing Processes and Packaging: Have the Limits Been Reached?” 
  •  3rd European MEMS & Sensors Summit powered by SEMI (September 19-21, Grenoble, France): “Megatrends Impacts on the MEMS Business” on September 20 – Speaker: Dr. Eric Mounier, Senior Analyst – Photonics, Sensing & Displays Division, Yole Development. As well as a presentation proposed by Pierre Cambou, Principal Analyst, Technology & Market, Imaging at Yole.

For more information, please contact Julie Robert.

Acronyms:
ASIC : Application Specific Integrated Circuit




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