DIE ATTACH - EQUIPMENT MARKET

Die attach equipment:
Yole’s analysts announce a consolidation of the market

Extracted from the Die Attach Equipment Market report performed by Yole Développement

OUTLINES:

  • Growing business and new technical challenges are ensuring consolidation of the die attach equipment market.
  • The die attach equipment market will have a 6% CAGR, reaching US$1.3 billion by 2024.
  • The die attach equipment industry is fuelled by assembly and packaging opportunities created by semiconductor megatrends.
  • Heterogeneous integration enabled by advanced packaging & 3D stacking is pushing the development of next generation die attach equipment.
  • There is increasing consolidation among die attach equipment suppliers.


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LYON, France – October 28, 2019:  “The die attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by assembly and packaging opportunities created by semiconductor megatrends”.
The latest semiconductor manufacturing report from Yole Développement (Yole) , titled Die Attach Equipment Market, is dedicated to the back-end packaging equipment industry with detailed technical roadmaps and a benchmarking of the related equipment. Die attach is a key process step for all semiconductor packaging companies. Today it becomes more and more strategic, with lot of issues as it regards all devices across various applications.
In this context, the market research and strategy consulting company proposes a comprehensive overview of this industry with technical insights and business trends. In this new report, Yole’s analysts segment and investigate the die attach equipment business by various parameters including bonding technologies and applications at the device level. This report reveals the competitive landscape with more than 70 companies identified and a detailed analysis of the supply chain. It is also a good opportunity to discover an in-depth analysis of the die bonder and flip-chip bonder markets.
Yole propose you today to discover the status of the die attach equipment market.

Today’s semiconductor megatrends include mobile devices, big data, AI , 5G wireless networking, HPC , IoT including industrial IoT, smart automotive, industry 4.0, and data centres. These applications create demand for electronics hardware, which requires high computing power, high speed, more bandwidth, low latency, low power, more functionality, more memory, system level integration and a variety of sensors. Such trends create business opportunities across various electronic device packaging platforms. However advanced packaging has one of the best opportunities, as it can fulfil various performance and complex heterogeneous integration requirements.

Die attach is a key process step in semiconductor packaging. It covers all devices across various applications and is a key contributor to assembly cost.
“The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends,” explains Santosh Kumar from Yole.
Die attach equipment can be classified into two categories: die bonders and FC bonders. The total market was worth US$979 million in 2018 and is expected to grow at 6% CAGR from 2018-2024 to reach US$1.3 billion. The FC bonder market will grow with a 12% CAGR to reach US$290 million in 2024 whereas the die bonder market will grow with a 5% CAGR to reach US$1.09 billion in 2024. By application, the highest growth is in stacked memory bonder market, with a 24% CAGR, followed by optoelectronics, with a 12% CAGR, and logic, with an 8% CAGR.

In terms of technology, epoxy bonding dominates die attach for wire-bond packaging, and related die bonders constituted around 85% of the total bonder market in 2018. However, epoxy bonding’s share will reduce to 53% by 2024. Eutectic bonding growth is driven by MEMS , high power LEDs and optoelectronics applications. C2W hybrid bonding is the emerging promising technology that can enable direct Cu- Cu bonding and has potential to replace TCB for the 3D stacked memory and high end logic application. However C2W hybrid bonding is still in its early stages level and is expected to hit the market in 2021 for stacked memory and in 2022/23 for logic devices with 2.5D structures…
A full description of this report is now available on i-Micronews.com.

Yole’s semiconductor manufacturing & advanced packaging team present key results all year long, during key trade shows and conferences. During the next weeks, the team has a huge agenda with key presentations all around the world. Discover below the program and make sure to be at the right place at the right time to meet Yole’s experts:

“Market Trends and Technologies in Advanced Packaging for 5G and HPC” on November 8 at 10:30 AM - Advanced Semiconductor Technology Conference 2019 (Singapore – Nov. 7&8, 2019).
Speaker: Favier Shoo, Technology & Market Analyst, Package Assembly and Substrate at Yole Développement.

“Polymeric Materials for Advanced Packaging” on November 12 at 1:10 PM during the Strategic Materials Conference at SEMICON Europa (Munich, Germany - Nov. 12-15, 2019) “Polymeric Materials for Advanced Packaging” on November 12 at 1:10 PM during the Strategic Materials Conference at SEMICON Europa (Munich, Germany - Nov. 12-15, 2019)
Speaker: Amandine Pizzagalli, Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement
“5G enabler : Advanced Packaging” on November 12 at 12:40 PM during the Advanced Packaging Conference at SEMICON Europa (Munich, Germany - Nov. 12-15, 2019) “5G enabler : Advanced Packaging” on November 12 at 12:40 PM during the Advanced Packaging Conference at SEMICON Europa (Munich, Germany - Nov. 12-15, 2019)
Speaker: Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement.

Stay tuned on i-Micronews.com to download all Yole’s presentations!


Acronyms:
AI : Artificial Intelligence
HPC : High Performance Computing
IoT : Internet of Things
FC : Flip-Chip
MEMS : Micro Electro Mechanical Systems
LED : Light Emitting Diodes
C2W : Chip-to wafer
TCB : Thermocompression Bonding





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