LYON, France – September 21, 2016: System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s inFO technology used for Apple’s A10® processor packaging. And few results are already available. Indeed System Plus Consulting’s experts propose you to discover a previous of the first conclusions.
Featured in the latest Apple iPhone 7®, the processor has higher performance, higher thermal dissipation, larger area, and lower power consumption compared to the previous generation A9 – and is much thinner.
This 3D component from Apple and TSMC integrates Samsung DRAM memories and a CPU , stacked in fan-out PoP configuration, also including through inFO vias. The package also features an innovative integration of passive components.
The fan-out advanced packaging platform market will be worth US$492 million in 2016 and is expected to exceed US$2.5 billion in 2021 according to fan-out technology & market report from Yole Développement, sister company of System Plus Consulting. While TSMC is driving the fan-out market, multiple companies are entering the field. (Source: Fan-Out: Technologies & Market Trends 2016 report, Yole Développement, August 2016)
System Plus Consulting report will include a complete physical analysis of the 3D fan-out packaging process, with details on all technical choices regarding processes and equipment. It will also feature a comprehensive comparison with the Apple A9® PoP process, Samsung’s latest PoP with through molded vias and Qualcomm PoP with molded core embedded package technology. Moreover, both companies, System Plus Consulting and Yole Développement, have identified and analyzed the complete manufacturing supply chain. They propose a detailed description of the manufacturing process with cost calculations. The full reverse engineering and costing analysis will be available soon. Stay tuned!
System Plus Consulting will attend Electronica 2016 (November 8-11, Messe München, Germany). Feel free to visit the System Plus Consulting team (Booth # B5.224/4). Contact: Lizzie Levenez.
InFO : Integrated Fan-Out
CPU : Central Processing Unit
PoP : Package-on-Package
About System Plus Consulting:
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems. Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product. System Plus Consulting engineers are experts in Integrated Circuits - Power Devices & Modules - MEMS & Sensors - Photonics – LED - Imaging – Display - Packaging - Electronic Boards & Systems.
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement. More info at www.systemplus.fr.
Press contact: Sandrine Leroy