Posted on December 17 | ADVANCED PACKAGING
PANEL-LEVEL PACKAGES, A PROMISING MARKET
For many years now, the semiconductor industry development has been governed by the Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel packages technologies.
“At Yole, we saw a growing enthusiasm for panel packages solutions dedicated to a selection of advanced packaging platforms,” asserts Amandine Pizzagalli, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole. And she adds: “The panel packages market is a competitive market which is attracting lot of new entrants compared to the existing advanced packaging market segments”.
Under the new advanced packaging analysis entitled “Status of Panel-Level Packaging & Manufacturing” released by Yole last November, the market research and strategy consulting company estimates, the panel packaging industry will reach US$ 109 million by 2017, with a market value of US$ 405 million by 2020.
Sandrine Leroy, Press Relations & Corporate Communication Manager (Email: email@example.com / Phone: +33 (0) 472 83 01 89).
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