EVENTS


Yole Développement attends more than 80 events this year.

To get more information on an event or to meet with our analysts, please contact Sandrine Leroy (
leroy@yole.fr).

Please find here 2014 events selected by Yole Développement.

See below our July - December 2014 selection:


11th Annual International Wafer-Level Packaging Conference & Exhibition (IWLPC)    
November 11-13, 2014
San Jose, USA

SMTA and Chip Scale Review are pleased to announce the 11th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

http://www.iwlpc.com/






TSensors (Trillion Sensors) Summit    
November 12-13, 2014
San Diego USA

The unprecedented forecast for sensor growth is supported by the emergence of multiple global economic tides including Internet of Everything (the largest economic tide in history of humans with forecasted growth by $19 trillion by 2020), emergence of Exponential Technologies accelerating growth of goods and services above the demand growth rate, and the emergence of Exponential Organizations redefining business models and replacing traditional linear organizations. The expected outcome will be massive creation of new jobs and Abundance, and the elimination of major global problems such as hunger, lack of medical care, clean water and energy within one generation, in about 20 years.

http://www.tsensorssummit.org/sandiegosummitho.html






Be flexible      
November 19 to 20, 2014
Munich, Germany 

This international platform with two consecutive days is intended for scientists, applied researchers, equipment suppliers and users. An excellent opportunity to exchange ideas and experiences in the world ofthin semiconductor devices and flexible electronics. The workshop day thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers, dicing concepts and self-assembly concepts as well as the integration in flexible electronic systems for a multitude of applications.

http://www.be-flexible.de/index.html






MRS     
November 30 to December 5, 2014
Boston, MA, USA 

Founded in 1973, MRS now consists of over 16,000 members from the United States — as well as nearly 70 other countries. The interdisciplinary materials science society is different from that of single discipline professional societies because it encourages communication and technical information exchange across the various fields of science affecting materials.

http://www.mrs.org/fall2014/






SEMICON Japan      
December 3 to 5, 2014
Tokyo, Japan

SEMICON Japan will move to a new venue this year! "Tokyo Big Sight" is ideally located in the Tokyo Metropolitan area both for visitors and exhibitors. At this new location, SEMICON Japan will address INNOVATIONs, through both exhibition and sessions, including:
- Next Generation Lithography
- New Transistor Architectures
- 2.5D and 3D ICs
- Nanoinprinting
- < 10 nm Processes ...
SEMICON Japan 2014 will also address mobile technologies and new and emerging markets driven by the explosion of interest in the Internet of Things.

http://www.semiconjapan.org/en/






3-D Architectures for semiconductor Integration and Packaging      
December 10 to 12, 2014
Burlingame, CA, USA 

Now in its 11th year, 3D Architectures for Semiconductor Integration and Packing (3D ASIP) is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena. 3D ASIP targets senior-level technologists, managers, and executives as speakers and attendees from leading companies and organizations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users. All speakers are invited...

http://techventure.rti.org/