Yole Développement attends more than 80 events this year.

To get more information on an event or to meet with our analysts, please contact Sandrine Leroy (

Please find here 2014 events selected by Yole Développement.

See below our July - December 2014 selection:

September 21 to 25, 2014
Grenoble, France

The aim of the conference is to discuss recent advances in theoretical and experimental investigations of crystal growth, characterization and control of material properties, as well as other basic research issues concerning wide bandgap semiconductors such as silicon carbide (SiC), III-nitrides, diamond and their related materials such as graphene.

SEMI MEMS Tech Seminar  
September 23, 2014
Milan Italy

Hosted by Politecnico di Milano SEMI Europe Grenoble Office invites you to attend its 3rd MEMS Tech Seminar on Sept 23rd, 2014 in Milan. This event, hosted by Politecnico di Milano, will focus on "The Future of MEMS: 2020 and Beyond". The MEMS Tech Seminar will feature experienced invited speakers from major organizations from the industry. Many networking opportunities will be proposed, including 2 Speed-Networking sessions (5 min per SEMI member company). Finally, prior the event, a Networking Dinner - not to be missed - will be proposed on Sept 22nd. This Tech Seminar is a SEMI Europe initiative to support European companies, start-ups and laboratories involved in the growing MEMS market

LpS (LED professional Symposium)   
October 1 to 2, 2014
Bregenz, Austria

It isn’t only the general lighting market that is being fundamentally changed by Solid State Lighting technologies; it’s the whole lighting industry. Predictions for the next five to seven years are that we’ll see more LED/OLED performance increases along with continuous price declines. The challenges of phasing out old technologies and ramping up new technologies are huge. Therefore, profitability is key to survival in this volatile environment.

European MicroWave Week    
October 5 to 10, 2014
Roma, Italy

The event focuses on the needs of engineers and researchers and offers an opportunity for both communities to discuss the latest trends and developments in the field of application of microwaves. Microwave devices, systems for telecommunications (both terrestrial and space-borne), transportation, medical, radar and new areas of application will be included in the programme. Particular emphasis will be placed on space-related technologies and applications.

SEMICON Europa    
October 7 to 9, 2014
Grenoble, France

Based on the intention to significantly increase the global semiconductor manufacturing share by public/private investment plans throughout Europe, SEMI has decided to rotate SEMICON Europe between the two largest semiconductor R&D and manufacturing clusters in Europe, namely Dresden and Grenoble. Consequently, SEMICON Europa 2014 will be held on October, 7-9 in Grenoble and return to Dresden in 2015. We are confident this rotation concept will provide increased business opportunities for our exhibitors and visitors. Additionally, we believe this strategy strongly supports the recently announced European Union’s EU10/100/20 initiative.

MEPTEC Semiconductor Packaging Technology Symposium   
October 23, 2014
Santa Clara, CA, USA 

In the areas of both design and manufacturing, the industry is pushing the limits, even in technologies once thought to be mature. This year, for its annual industry update, MEPTEC is bringing together packaging experts in these critical areas and others to present detailed technical updates. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place on one day. The opportunity to learn is enhanced with MEPTEC’s unmatched Silicon Valley networking opportunities built into the day.

MEMS Executive Congress US     
November 5 to 7, 2014
Scottsdale, AZ, USA 

The 10th annual MEMS Executive Congress is the only place for technology executives to:
- Find MEMS and sensor-based solutions to customer needs
- Discover how MEMS and sensors can drive competitive advantage
- Learn about new consumer-driven, market-based opportunities for MEMS and sensor solutions
- Network with other, high quality MEMS and sensors executives

Global Interposer Technology 2014 Workshop (GIT 2014)     
November 5 to 7, 2014
Atlanta, GA, USA 

The GIT 2014 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.

11th Annual International Wafer-Level Packaging Conference & Exhibition (IWLPC)    
November 11-13, 2014
San Jose, USA

SMTA and Chip Scale Review are pleased to announce the 11th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

TSensors (Trillion Sensors) Summit    
November 12-13, 2014
San Diego USA

The unprecedented forecast for sensor growth is supported by the emergence of multiple global economic tides including Internet of Everything (the largest economic tide in history of humans with forecasted growth by $19 trillion by 2020), emergence of Exponential Technologies accelerating growth of goods and services above the demand growth rate, and the emergence of Exponential Organizations redefining business models and replacing traditional linear organizations. The expected outcome will be massive creation of new jobs and Abundance, and the elimination of major global problems such as hunger, lack of medical care, clean water and energy within one generation, in about 20 years.

Be flexible      
November 19 to 20, 2014
Munich, Germany 

This international platform with two consecutive days is intended for scientists, applied researchers, equipment suppliers and users. An excellent opportunity to exchange ideas and experiences in the world ofthin semiconductor devices and flexible electronics. The workshop day thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers, dicing concepts and self-assembly concepts as well as the integration in flexible electronic systems for a multitude of applications.

November 30 to December 5, 2014
Boston, MA, USA 

Founded in 1973, MRS now consists of over 16,000 members from the United States — as well as nearly 70 other countries. The interdisciplinary materials science society is different from that of single discipline professional societies because it encourages communication and technical information exchange across the various fields of science affecting materials.

SEMICON Japan      
December 3 to 5, 2014
Tokyo, Japan

SEMICON Japan will move to a new venue this year! "Tokyo Big Sight" is ideally located in the Tokyo Metropolitan area both for visitors and exhibitors. At this new location, SEMICON Japan will address INNOVATIONs, through both exhibition and sessions, including:
- Next Generation Lithography
- New Transistor Architectures
- 2.5D and 3D ICs
- Nanoinprinting
- < 10 nm Processes ...
SEMICON Japan 2014 will also address mobile technologies and new and emerging markets driven by the explosion of interest in the Internet of Things.

3-D Architectures for semiconductor Integration and Packaging      
December 10 to 12, 2014
Burlingame, CA, USA 

Now in its 11th year, 3D Architectures for Semiconductor Integration and Packing (3D ASIP) is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena. 3D ASIP targets senior-level technologists, managers, and executives as speakers and attendees from leading companies and organizations from around the world, and strives to serve the needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users. All speakers are invited...